System-on-modules
Forty-five modules across five silicon vendors and three footprints. Every dimension below is the one on the mechanical drawing.
Vendor
Footprint
45 modules
| Part | Silicon | Cores | NPU | Memory | Ethernet | Temperature | Size |
|---|---|---|---|---|---|---|---|
| RP-RK3588 | Rockchip RK3588 | 4 × A76 + 4 × A55 | 6 TOPS | LPDDR4x 4 / 8 / 16 GB | 2 × RGMII | −10 to +75 °C | 58 × 44 × 3.5 |
| DR4-RK3588 | Rockchip RK3588 | 4 × A76 + 4 × A55 | 6 TOPS | LPDDR4x 4 / 8 / 16 GB | 2 × RGMII | −10 to +75 °C | 69.6 × 65 × 4.2 |
| RP-RK3588S | Rockchip RK3588S | 4 × A76 + 4 × A55 | 6 TOPS | LPDDR4x 4 / 8 / 16 GB | 1 × RGMII | −10 to +75 °C | 50 × 50 × 3 |
| RP-RK3576 | Rockchip RK3576 | 4 × A72 + 4 × A53 | 6 TOPS | LPDDR5 2 / 4 / 8 / 16 GB | 2 × RGMII | −10 to +75 °C | 42 × 42 × 3.2 |
| RP-RK3576JIndustrial temperature range | Rockchip RK3576J | 4 × A72 + 4 × A53 | 6 TOPS | LPDDR4 2 / 4 / 8 / 16 GB | 2 × RGMII | −40 to +85 °C | 42 × 42 × 3.2 |
| DR4-RK3576 | Rockchip RK3576 | 4 × A72 + 4 × A53 | 6 TOPS | LPDDR4x 2 / 4 / 8 / 16 GB | 2 × RGMII | −10 to +75 °C | 69.9 × 30 × 3 |
| RP-RK3568 | Rockchip RK3568 | 4 × A55 | none | LPDDR4 2 GB, 4 / 8 GB option | 2 × RGMII | −10 °C and up | 50 × 50 × 3.2 |
| RP-RK3568JIndustrial temperature range | Rockchip RK3568J | 4 × A55 | none | LPDDR4 2 GB, 4 / 8 GB option | 2 × RGMII | −40 °C and up | 50 × 50 × 3.2 |
| LGA-RK3568 | Rockchip RK3568B2 | 4 × A55 | none | LPDDR4 2 GB, 4 / 8 GB option | 2 × RGMII | −10 °C and up | 40 × 40 × 3.2 |
| RP-RK3566 | Rockchip RK3566 | 4 × A55 | none | LPDDR4 2 GB, 4 / 8 GB option | 1 × RGMII | −10 °C and up | 50 × 50 × 3.2 |
| LGA-RK3566 | Rockchip RK3566 | 4 × A55 | none | LPDDR4/4x 2 GB, 4 / 8 GB option | PHY on carrier | −10 °C and up | 40 × 40 × 3.2 |
| RP-RK3562 | Rockchip RK3562 | 4 × A53 at 2.0 GHz | 1 TOPS | DDR4 1 / 2 GB, 4 GB at volume | RGMII + RMII | −10 °C and up | 42 × 42 × 3 |
| RP-RK3528A | Rockchip RK3528A | 4 × A53 at 2.0 GHz | none | DDR4 1 / 2 GB, 4 GB at volume | RGMII + RMII PHY | −10 °C and up | 42 × 42 × 3.1 |
| RP-RK3506G | Rockchip RK3506G2 | 3 × A7 at 1.5 GHz | none | DDR3 128 MB | 2 × RMII | −10 °C and up | 36.5 × 36.5 × 3.1 |
| RP-PX30 | Rockchip PX30 | 4 × A35 at 1.3 GHz | none | LPDDR3 1 GB, 2 GB at volume | 1 × 10/100M | −10 °C and up | 44 × 44 × 3 |
| RP-RV1126B | Rockchip RV1126B | 4 × A53 at 1.6 GHz | 3 TOPS | DDR4 1 GB, 2 / 4 GB at volume | 2 × RGMII gigabit | −10 °C and up | 42 × 42 × 3.2 |
| RP-RV1126 | Rockchip RV1126 | 4 × A7 at 1.2 GHz | 2 TOPS | DDR4 2 GB, 1 GB option | 1 × RGMII gigabit | −10 °C and up | 44 × 44 × 3.2 |
| LGA-RV1126 | Rockchip RV1126 | 4 × A7 at 1.5 GHz | 2 TOPS | LPDDR4 1 GB, 2 / 4 GB option | 1 × RGMII gigabit | −10 °C and up | 35 × 35 × 3.2 |
| RP-RV1106 | Rockchip RV1106 | 1 × A7 + MCU | 0.5 TOPS | DDR3L 128 / 256 MB in package | 1 × 100M | −10 to +75 °C | 40 × 30 × 2.8 |
| RP-RV1103 | Rockchip RV1103 | 1 × A7 + MCU | 0.5 TOPS | DDR2 64 MB in package | 1 × 100M | −10 to +75 °C | 40 × 30 × 2.8 |
| PCIE-RV1106 | Rockchip RV1106 | 1 × A7 + MCU | 0.5 TOPS | DDR3 128 MB in package | 1 × 100M | −10 to +75 °C | 30 × 22 × 2.8 |
| PCIE-RV1103 | Rockchip RV1103 | 1 × A7 + MCU | 0.5 TOPS | DDR2 64 MB in package | 1 × 100M | −10 to +75 °C | 30 × 22 × 2.8 |
| RP3399 | Rockchip RK3399 | 2 × A72 + 4 × A53 | none | DDR3 2 GB, 4 GB at volume | PHY on carrier | −10 °C and up | 54 × 46 × 3.2 |
| RP3288 | Rockchip RK3288 | 4 × A17 | none | DDR3 2 GB, 1 / 4 GB at volume | PHY on carrier | −10 °C and up | 60 × 46 × 3.2 |
| RP-T536 | Allwinner T536 | 4 × A55 at 1.75 GHz | 3 TOPS | LPDDR4 2 / 4 GB, 1 / 8 GB at volume | 2 × RGMII gigabit | −10 °C and up | 42 × 42 × 3.6 |
| RP-T527 | Allwinner T527 | 8 × A55 at 2.0 GHz | none | LPDDR4 2 / 4 GB, 1 GB at volume | 2 × RGMII | −10 °C and up | 42 × 42 × 3.2 |
| RP-A527 | Allwinner A527 | 8 × A55 at 2.0 GHz | none | LPDDR4 2 / 4 GB, 1 GB at volume | 2 × RGMII | −10 °C and up | 42 × 42 × 3.2 |
| RP-A523 | Allwinner A523 | 8 × A55 at 1.8 GHz | none | LPDDR4 2 / 4 GB, 1 GB at volume | 1 × RGMII | −10 °C and up | 42 × 42 × 3.1 |
| RP-T507Industrial temperature range | Allwinner T507 | 4 × A53 at 1.5 GHz | none | LPDDR4 2 GB, 1 / 4 GB at volume | GMAC + EMAC PHY | −10 °C and up | 45 × 45 × 3 |
| RP-A133 | Allwinner A133 | 4 × A53 at 1.5 GHz | none | LPDDR4 2 / 4 GB, 1 GB at volume | 1 × GMAC | −20 °C and up | 44 × 44 × 2.5 |
| RP-A40i | Allwinner A40i-H | 4 × A7 at 1.2 GHz | none | DDR3 1 GB, 2 GB at volume | 1 × GMAC PHY | −10 °C and up | 60 × 45 × 3 |
| RP-T113-S3Industrial temperature range | Allwinner T113-S3 | 2 × A7 | none | DDR3 128 MB in package | 1 × RMII 100M | −25 to +85 °C | 40 × 30 × 3 |
| RP-IMX93 | NXP i.MX 93 | 2 × A55 | 0.5 TOPS | LPDDR4/4x 512 MB, 1 / 2 GB option | 2 × RGMII PHY | −10 °C and up | 42 × 42 × 3 |
| PRO-8M PlusIndustrial temperature range | NXP i.MX 8M Plus | 4 × A53 | 2.3 TOPS | LPDDR4 2 / 4 GB, 1 GB option | 2 × RGMII PHY | −40 °C and up | 60 × 40 × 4.2 |
| PRO-8MINIIndustrial temperature range | NXP i.MX 8M Mini | 4 × A53 | none | LPDDR4 2 GB, 1 GB option | PHY on carrier | −40 °C and up | 60 × 40 × 4.2 |
| RP6Q | NXP i.MX 6Quad | 4 × A9 | none | DDR3 2 GB, 1 GB at volume | PHY on carrier | −10 °C and up | 60 × 40 × 3.2 |
| RP-3519DV500 | HiSilicon Hi3519DV500 | 2 × A55 at 1.0 GHz | 2.5 TOPS | DDR4 1 / 2 GB, 4 GB option | 1 × RGMII | −10 °C and up | 42 × 42 × 3.2 |
| PRO-HI3403V100 | HiSilicon Hi3403V100 | 4 × A55 at 1.4 GHz | 10 TOPS | LPDDR4/4X 8 GB, 2 / 4 GB option | 1 × RGMII | −10 °C and up | 60 × 50 × 5.2 |
| PRO-HI3519AV200 | HiSilicon Hi3519AV200 | 4 × A55 at 1.4 GHz | 2.5 TOPS | LPDDR4/4X 8 GB, 2 / 4 GB option | 1 × RGMII | −10 °C and up | 60 × 50 × 5.2 |
| PCIE-CV610 | HiSilicon Hi3516CV610 | 2 × A7 at 900 MHz | 1 TOPS | DDR 128 MB in package | 1 × RMII 10/100M | −10 to +75 °C | 80 × 60 × 14 |
| RP-DV300 | HiSilicon Hi3516DV300 | 2 × A7 at 900 MHz | 1 TOPS | DDR3 1 GB, 512 MB / 2 GB at volume | 1 × EMAC PHY 100M | −10 °C and up | 45 × 45 × 3 |
| RP-A311D | Amlogic A311D | 4 × A73 + 2 × A53 | 5 TOPS | LPDDR4 2 GB, 1 / 4 GB at volume | EMAC 100M in SoC | −10 °C and up | 45 × 45 × 3.2 |
| PRO-A311D2 | Amlogic A311D2 | 4 × A73 + 4 × A53 | 3 TOPS | LPDDR4x 8 GB, 16 GB option | PHY on carrier | −10 °C and up | 60 × 40 × 4.2 |
| RP-S905 | Amlogic S905 | 4 × A55 | 1.2 TOPS | LPDDR4 2 GB, 1 / 4 GB at volume | EMAC 100M in SoC | −10 °C and up | 45 × 45 × 3.2 |
| PRO-T972 | Amlogic T972 | 4 × A55 | none | LPDDR4 2 GB, 4 GB option | EMAC 100M in SoC | −10 °C and up | 60 × 40 × 4.2 |
RP-RK3588
Rockchip RK3588
- Cores
- 4 × A76 + 4 × A55
- NPU
- 6 TOPS
- Memory
- LPDDR4x 4 / 8 / 16 GB
- Ethernet
- 2 × RGMII
- Temperature
- −10 to +75 °C
- Size
- 58 × 44 × 3.5 mm
DR4-RK3588
Rockchip RK3588
- Cores
- 4 × A76 + 4 × A55
- NPU
- 6 TOPS
- Memory
- LPDDR4x 4 / 8 / 16 GB
- Ethernet
- 2 × RGMII
- Temperature
- −10 to +75 °C
- Size
- 69.6 × 65 × 4.2 mm
RP-RK3588S
Rockchip RK3588S
- Cores
- 4 × A76 + 4 × A55
- NPU
- 6 TOPS
- Memory
- LPDDR4x 4 / 8 / 16 GB
- Ethernet
- 1 × RGMII
- Temperature
- −10 to +75 °C
- Size
- 50 × 50 × 3 mm
RP-RK3576
Rockchip RK3576
- Cores
- 4 × A72 + 4 × A53
- NPU
- 6 TOPS
- Memory
- LPDDR5 2 / 4 / 8 / 16 GB
- Ethernet
- 2 × RGMII
- Temperature
- −10 to +75 °C
- Size
- 42 × 42 × 3.2 mm
RP-RK3576J
Rockchip RK3576J
Industrial temperature range
- Cores
- 4 × A72 + 4 × A53
- NPU
- 6 TOPS
- Memory
- LPDDR4 2 / 4 / 8 / 16 GB
- Ethernet
- 2 × RGMII
- Temperature
- −40 to +85 °C
- Size
- 42 × 42 × 3.2 mm
DR4-RK3576
Rockchip RK3576
- Cores
- 4 × A72 + 4 × A53
- NPU
- 6 TOPS
- Memory
- LPDDR4x 2 / 4 / 8 / 16 GB
- Ethernet
- 2 × RGMII
- Temperature
- −10 to +75 °C
- Size
- 69.9 × 30 × 3 mm
RP-RK3568
Rockchip RK3568
- Cores
- 4 × A55
- NPU
- none
- Memory
- LPDDR4 2 GB, 4 / 8 GB option
- Ethernet
- 2 × RGMII
- Temperature
- −10 °C and up
- Size
- 50 × 50 × 3.2 mm
RP-RK3568J
Rockchip RK3568J
Industrial temperature range
- Cores
- 4 × A55
- NPU
- none
- Memory
- LPDDR4 2 GB, 4 / 8 GB option
- Ethernet
- 2 × RGMII
- Temperature
- −40 °C and up
- Size
- 50 × 50 × 3.2 mm
LGA-RK3568
Rockchip RK3568B2
- Cores
- 4 × A55
- NPU
- none
- Memory
- LPDDR4 2 GB, 4 / 8 GB option
- Ethernet
- 2 × RGMII
- Temperature
- −10 °C and up
- Size
- 40 × 40 × 3.2 mm
RP-RK3566
Rockchip RK3566
- Cores
- 4 × A55
- NPU
- none
- Memory
- LPDDR4 2 GB, 4 / 8 GB option
- Ethernet
- 1 × RGMII
- Temperature
- −10 °C and up
- Size
- 50 × 50 × 3.2 mm
LGA-RK3566
Rockchip RK3566
- Cores
- 4 × A55
- NPU
- none
- Memory
- LPDDR4/4x 2 GB, 4 / 8 GB option
- Ethernet
- PHY on carrier
- Temperature
- −10 °C and up
- Size
- 40 × 40 × 3.2 mm
RP-RK3562
Rockchip RK3562
- Cores
- 4 × A53 at 2.0 GHz
- NPU
- 1 TOPS
- Memory
- DDR4 1 / 2 GB, 4 GB at volume
- Ethernet
- RGMII + RMII
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3 mm
RP-RK3528A
Rockchip RK3528A
- Cores
- 4 × A53 at 2.0 GHz
- NPU
- none
- Memory
- DDR4 1 / 2 GB, 4 GB at volume
- Ethernet
- RGMII + RMII PHY
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3.1 mm
RP-RK3506G
Rockchip RK3506G2
- Cores
- 3 × A7 at 1.5 GHz
- NPU
- none
- Memory
- DDR3 128 MB
- Ethernet
- 2 × RMII
- Temperature
- −10 °C and up
- Size
- 36.5 × 36.5 × 3.1 mm
RP-PX30
Rockchip PX30
- Cores
- 4 × A35 at 1.3 GHz
- NPU
- none
- Memory
- LPDDR3 1 GB, 2 GB at volume
- Ethernet
- 1 × 10/100M
- Temperature
- −10 °C and up
- Size
- 44 × 44 × 3 mm
RP-RV1126B
Rockchip RV1126B
- Cores
- 4 × A53 at 1.6 GHz
- NPU
- 3 TOPS
- Memory
- DDR4 1 GB, 2 / 4 GB at volume
- Ethernet
- 2 × RGMII gigabit
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3.2 mm
RP-RV1126
Rockchip RV1126
- Cores
- 4 × A7 at 1.2 GHz
- NPU
- 2 TOPS
- Memory
- DDR4 2 GB, 1 GB option
- Ethernet
- 1 × RGMII gigabit
- Temperature
- −10 °C and up
- Size
- 44 × 44 × 3.2 mm
LGA-RV1126
Rockchip RV1126
- Cores
- 4 × A7 at 1.5 GHz
- NPU
- 2 TOPS
- Memory
- LPDDR4 1 GB, 2 / 4 GB option
- Ethernet
- 1 × RGMII gigabit
- Temperature
- −10 °C and up
- Size
- 35 × 35 × 3.2 mm
RP-RV1106
Rockchip RV1106
- Cores
- 1 × A7 + MCU
- NPU
- 0.5 TOPS
- Memory
- DDR3L 128 / 256 MB in package
- Ethernet
- 1 × 100M
- Temperature
- −10 to +75 °C
- Size
- 40 × 30 × 2.8 mm
RP-RV1103
Rockchip RV1103
- Cores
- 1 × A7 + MCU
- NPU
- 0.5 TOPS
- Memory
- DDR2 64 MB in package
- Ethernet
- 1 × 100M
- Temperature
- −10 to +75 °C
- Size
- 40 × 30 × 2.8 mm
PCIE-RV1106
Rockchip RV1106
- Cores
- 1 × A7 + MCU
- NPU
- 0.5 TOPS
- Memory
- DDR3 128 MB in package
- Ethernet
- 1 × 100M
- Temperature
- −10 to +75 °C
- Size
- 30 × 22 × 2.8 mm
PCIE-RV1103
Rockchip RV1103
- Cores
- 1 × A7 + MCU
- NPU
- 0.5 TOPS
- Memory
- DDR2 64 MB in package
- Ethernet
- 1 × 100M
- Temperature
- −10 to +75 °C
- Size
- 30 × 22 × 2.8 mm
RP3399
Rockchip RK3399
- Cores
- 2 × A72 + 4 × A53
- NPU
- none
- Memory
- DDR3 2 GB, 4 GB at volume
- Ethernet
- PHY on carrier
- Temperature
- −10 °C and up
- Size
- 54 × 46 × 3.2 mm
RP3288
Rockchip RK3288
- Cores
- 4 × A17
- NPU
- none
- Memory
- DDR3 2 GB, 1 / 4 GB at volume
- Ethernet
- PHY on carrier
- Temperature
- −10 °C and up
- Size
- 60 × 46 × 3.2 mm
RP-T536
Allwinner T536
- Cores
- 4 × A55 at 1.75 GHz
- NPU
- 3 TOPS
- Memory
- LPDDR4 2 / 4 GB, 1 / 8 GB at volume
- Ethernet
- 2 × RGMII gigabit
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3.6 mm
RP-T527
Allwinner T527
- Cores
- 8 × A55 at 2.0 GHz
- NPU
- none
- Memory
- LPDDR4 2 / 4 GB, 1 GB at volume
- Ethernet
- 2 × RGMII
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3.2 mm
RP-A527
Allwinner A527
- Cores
- 8 × A55 at 2.0 GHz
- NPU
- none
- Memory
- LPDDR4 2 / 4 GB, 1 GB at volume
- Ethernet
- 2 × RGMII
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3.2 mm
RP-A523
Allwinner A523
- Cores
- 8 × A55 at 1.8 GHz
- NPU
- none
- Memory
- LPDDR4 2 / 4 GB, 1 GB at volume
- Ethernet
- 1 × RGMII
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3.1 mm
RP-T507
Allwinner T507
Industrial temperature range
- Cores
- 4 × A53 at 1.5 GHz
- NPU
- none
- Memory
- LPDDR4 2 GB, 1 / 4 GB at volume
- Ethernet
- GMAC + EMAC PHY
- Temperature
- −10 °C and up
- Size
- 45 × 45 × 3 mm
RP-A133
Allwinner A133
- Cores
- 4 × A53 at 1.5 GHz
- NPU
- none
- Memory
- LPDDR4 2 / 4 GB, 1 GB at volume
- Ethernet
- 1 × GMAC
- Temperature
- −20 °C and up
- Size
- 44 × 44 × 2.5 mm
RP-A40i
Allwinner A40i-H
- Cores
- 4 × A7 at 1.2 GHz
- NPU
- none
- Memory
- DDR3 1 GB, 2 GB at volume
- Ethernet
- 1 × GMAC PHY
- Temperature
- −10 °C and up
- Size
- 60 × 45 × 3 mm
RP-T113-S3
Allwinner T113-S3
Industrial temperature range
- Cores
- 2 × A7
- NPU
- none
- Memory
- DDR3 128 MB in package
- Ethernet
- 1 × RMII 100M
- Temperature
- −25 to +85 °C
- Size
- 40 × 30 × 3 mm
RP-IMX93
NXP i.MX 93
- Cores
- 2 × A55
- NPU
- 0.5 TOPS
- Memory
- LPDDR4/4x 512 MB, 1 / 2 GB option
- Ethernet
- 2 × RGMII PHY
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3 mm
PRO-8M Plus
NXP i.MX 8M Plus
Industrial temperature range
- Cores
- 4 × A53
- NPU
- 2.3 TOPS
- Memory
- LPDDR4 2 / 4 GB, 1 GB option
- Ethernet
- 2 × RGMII PHY
- Temperature
- −40 °C and up
- Size
- 60 × 40 × 4.2 mm
PRO-8MINI
NXP i.MX 8M Mini
Industrial temperature range
- Cores
- 4 × A53
- NPU
- none
- Memory
- LPDDR4 2 GB, 1 GB option
- Ethernet
- PHY on carrier
- Temperature
- −40 °C and up
- Size
- 60 × 40 × 4.2 mm
RP6Q
NXP i.MX 6Quad
- Cores
- 4 × A9
- NPU
- none
- Memory
- DDR3 2 GB, 1 GB at volume
- Ethernet
- PHY on carrier
- Temperature
- −10 °C and up
- Size
- 60 × 40 × 3.2 mm
RP-3519DV500
HiSilicon Hi3519DV500
- Cores
- 2 × A55 at 1.0 GHz
- NPU
- 2.5 TOPS
- Memory
- DDR4 1 / 2 GB, 4 GB option
- Ethernet
- 1 × RGMII
- Temperature
- −10 °C and up
- Size
- 42 × 42 × 3.2 mm
PRO-HI3403V100
HiSilicon Hi3403V100
- Cores
- 4 × A55 at 1.4 GHz
- NPU
- 10 TOPS
- Memory
- LPDDR4/4X 8 GB, 2 / 4 GB option
- Ethernet
- 1 × RGMII
- Temperature
- −10 °C and up
- Size
- 60 × 50 × 5.2 mm
PRO-HI3519AV200
HiSilicon Hi3519AV200
- Cores
- 4 × A55 at 1.4 GHz
- NPU
- 2.5 TOPS
- Memory
- LPDDR4/4X 8 GB, 2 / 4 GB option
- Ethernet
- 1 × RGMII
- Temperature
- −10 °C and up
- Size
- 60 × 50 × 5.2 mm
PCIE-CV610
HiSilicon Hi3516CV610
- Cores
- 2 × A7 at 900 MHz
- NPU
- 1 TOPS
- Memory
- DDR 128 MB in package
- Ethernet
- 1 × RMII 10/100M
- Temperature
- −10 to +75 °C
- Size
- 80 × 60 × 14 mm
RP-DV300
HiSilicon Hi3516DV300
- Cores
- 2 × A7 at 900 MHz
- NPU
- 1 TOPS
- Memory
- DDR3 1 GB, 512 MB / 2 GB at volume
- Ethernet
- 1 × EMAC PHY 100M
- Temperature
- −10 °C and up
- Size
- 45 × 45 × 3 mm
RP-A311D
Amlogic A311D
- Cores
- 4 × A73 + 2 × A53
- NPU
- 5 TOPS
- Memory
- LPDDR4 2 GB, 1 / 4 GB at volume
- Ethernet
- EMAC 100M in SoC
- Temperature
- −10 °C and up
- Size
- 45 × 45 × 3.2 mm
PRO-A311D2
Amlogic A311D2
- Cores
- 4 × A73 + 4 × A53
- NPU
- 3 TOPS
- Memory
- LPDDR4x 8 GB, 16 GB option
- Ethernet
- PHY on carrier
- Temperature
- −10 °C and up
- Size
- 60 × 40 × 4.2 mm
RP-S905
Amlogic S905
- Cores
- 4 × A55
- NPU
- 1.2 TOPS
- Memory
- LPDDR4 2 GB, 1 / 4 GB at volume
- Ethernet
- EMAC 100M in SoC
- Temperature
- −10 °C and up
- Size
- 45 × 45 × 3.2 mm
PRO-T972
Amlogic T972
- Cores
- 4 × A55
- NPU
- none
- Memory
- LPDDR4 2 GB, 4 GB option
- Ethernet
- EMAC 100M in SoC
- Temperature
- −10 °C and up
- Size
- 60 × 40 × 4.2 mm
RP-RK3588
58 × 44 mm
DR4-RK3588
69.6 × 65 mm
RP-RK3588S
50 × 50 mm
RP-RK3576
42 × 42 mm
RP-RK3576J
42 × 42 mm
DR4-RK3576
69.9 × 30 mm
RP-RK3568
50 × 50 mm
RP-RK3568J
50 × 50 mm
LGA-RK3568
40 × 40 mm
RP-RK3566
50 × 50 mm
LGA-RK3566
40 × 40 mm
RP-RK3562
42 × 42 mm
RP-RK3528A
42 × 42 mm
RP-RK3506G
36.5 × 36.5 mm
RP-PX30
44 × 44 mm
RP-RV1126B
42 × 42 mm
RP-RV1126
44 × 44 mm
LGA-RV1126
35 × 35 mm
RP-RV1106
40 × 30 mm
RP-RV1103
40 × 30 mm
PCIE-RV1106
30 × 22 mm
PCIE-RV1103
30 × 22 mm
RP3399
54 × 46 mm
RP3288
60 × 46 mm
RP-T536
42 × 42 mm
RP-T527
42 × 42 mm
RP-A527
42 × 42 mm
RP-A523
42 × 42 mm
RP-T507
45 × 45 mm
RP-A133
44 × 44 mm
RP-A40i
60 × 45 mm
RP-T113-S3
40 × 30 mm
RP-IMX93
42 × 42 mm
PRO-8M Plus
60 × 40 mm
PRO-8MINI
60 × 40 mm
RP6Q
60 × 40 mm
RP-3519DV500
42 × 42 mm
PRO-HI3403V100
60 × 50 mm
PRO-HI3519AV200
60 × 50 mm
PCIE-CV610
80 × 60 mm
RP-DV300
45 × 45 mm
RP-A311D
45 × 45 mm
PRO-A311D2
60 × 40 mm
RP-S905
45 × 45 mm
PRO-T972
60 × 40 mm