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Four hundred ARM modules, held in supply for a decade.

Rongpin has drawn system-on-modules in Bao'an, Shenzhen since 2011. Rockchip, Allwinner, NXP, HiSilicon and Amlogic silicon on board-to-board, solder-down and card-edge footprints, with the carrier boards, fanless box PCs and Android panel computers that go around them.

Location
Shenzhen · Bao'an
Established
April 2011
Catalogue
400+ part numbers
Platforms
5 silicon vendors

Thirteen modules at true relative scale

Drawn against each other at the dimensions on their own drawings, from the 30 × 22 mm camera module to the 69.6 × 65 mm RK3588. Pick a board to read its specification.

10 mm per division

DR4-RK3588

Silicon
Rockchip RK3588
Cores
4 × A76 + 4 × A55
NPU
6 TOPS
Memory
LPDDR4x 4 / 8 / 16 GB
Ethernet
2 × RGMII
Temperature
−10 to +75 °C
Size
69.6 × 65 × 4.2 mm

Five silicon vendors, one set of carriers

A carrier drawn for one module usually takes its neighbours. That is the point of keeping every vendor on the same footprints.

Rockchip瑞芯微
The largest of the five lines and the one with the most footprints. Twenty-four Rockchip parts are live, from a 64 MB RV1103 camera module to a 16 GB RK3588.
RK3588 · RK3588S · RK3576 · RK3572 · RK3568 · RK3566 · RK3562 · RK3528 · RK3506 · RK3399 · RK3399Pro · RK3368 · RK3328 · RK3288 · RK3128 · RK3308H · PX30 · RK1808 · RK182X · RV1126B · RV1126 · RV1109 · RV1106 · RV1103
Allwinner全志
Where the panel computers mostly land. The T527 and A527 carry eight A55 cores at 2 GHz; the T113-S3 runs from −25 to +85 °C on 128 MB.
T536 · T527 · T507 · T509 · T736 · T113-i · T113-S3 · T3 · A733 · A537 · A527 · A523 · A333 · A133P · A133 · A40i · H6
NXP飛思卡爾
The line customers reach for when a design has to hold −40 °C and a long qualification. The 8M Plus and 8M Mini modules are both rated from −40 °C.
i.MX 95 · i.MX 93 · i.MX 9352 · i.MX 8M Plus · i.MX 8M Mini · i.MX 6
HiSilicon華為海思
Vision silicon, and the only line with a card-edge part. The Hi3403V100 module carries the largest NPU in the catalogue at 10 TOPS with 8 GB of LPDDR4X as standard.
Hi3403V100 · Hi3519AV200 · Hi3519DV500 · Hi3516XDV500 · Hi3516DV300 · CV610 · CV500
Amlogic晶晨
Media and signage work. The A311D pairs four A73 cores with two A53 and a 5 TOPS NPU on a 45 mm square.
A311D2 · A311D · T972 · S905D3 · S905

How to read a part number

The prefix is the footprint and the suffix is the grade. Once you know the two, the whole catalogue sorts itself.

RP-Board-to-board
The mainstream module. Mates to a carrier through stacked connectors and comes out again with a spudger.
PRO-Wide footprint
60 mm and up, more pins broken out, and the memory ceiling raised. Where the 10 TOPS and 16 GB parts live.
DR4-Widest
The largest module drawn, up to 69.6 × 65 mm on the RK3588, for designs that need everything the SoC can offer.
LGA-Solder-down
No connector. The module reflows onto the carrier, which removes a mating surface and shrinks the RK3568 from 50 to 40 mm square.
PCIE-Edge card
A card edge instead of a connector, 30 × 22 mm. The smallest thing in the catalogue and the one that goes inside cameras.
JIndustrial
A J on the end widens the temperature range. RP-RK3576 is rated −10 to +75 °C; RP-RK3576J is rated −40 to +85 °C on the same footprint.

10+yearsof supply on a board, from the day it ships

The reason customers put a Rongpin module inside a teller machine or an aesthetic laser is that the board is still orderable when the product is recertified. Small runs and volume runs are both taken. Where a SoC goes end of life, a pin-compatible successor on the same footprint is the first thing drawn.

A module is a promise about the next ten years, written in solder.

Where the boards end up

Six of the places these modules are running. In every one of them, the board is invisible and the cost of changing it is the whole programme.

Applications

Engineering support runs on a ticket, not an inbox

Customers get an account on the Rongpin Redmine, where schematic questions, driver issues and BSP requests are filed, numbered and tracked to close. Deep system customisation, board bring-up on Android, Ubuntu and mainline Linux, and peripheral driver work are all done in house.

Tell us the peripherals, the temperature range and the volume, and you will get a module shortlist and a carrier proposal back.

Send a specification